EDCI Ship the Chip Sp 2012

By Jenny Meyer, Hannah Henry1

1. Purdue University

Download (DOC)

Licensed under

Category

Lesson Plans

Published on

Abstract

This is a lesson plan completed in EDCI 365 about packaging engineering. Students pack a single chip to another school.

Cite this work

Researchers should cite this work as follows:

  • Jenny Meyer; Hannah Henry (2012), "EDCI Ship the Chip Sp 2012," https://stemedhub.org/resources/853.

    BibTex | EndNote

Tags

  1. engineering
  2. grade 5
  3. lesson plan
  4. mass
  5. packaging
  6. surface area
  7. volume
  8. weight